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High-grade steel mesh stencil — 1:1 aperture pattern for the Allwinner H3 ball footprint
a multimeter for higher-voltage probing
The patented aluminum integrated radiator design uses forced liquid circulation to remove heat from the ASIC chips on each hashboard
excessive heat (especially without a heatsink or with a failed CPU fan)
headphone VESA Mount 100 × 100mm Condition New (original Samsung)
HY268 Thermal Putty 8.0W/m·K (80g Cartridge) for ASIC, GPU & Power Electronics bm1398 High-grade steel mesh stencil —HY268 Thermal Putty 8. 0W mK 80g Cartridge for ASIC, GPU & Power Electronics The HY268 thermal putty is a gap filling thermal interface material rated at thermal conductivity above 8. 0W mK, designed for applications where traditional thermal grease or pre cut pads fall short. Packaged in an 80g 30cc cartridge, it bridges uneven contact surfaces and variable component heights with stable thermal contact and no flow under thermal cycling. HY268 is well
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